Research and develop new packaging technologies and solutions to enable industry-leading high power opto-electronic devices, including thermal, optical, mechanical, electronic aspects
- Responsible for performing theoretical calculations and empirical measurements to characterize new concepts; preparing and reporting verification data for proof-of-concept samples to support transfer of new concepts from Technology to Engineering; identifying new technologies to support roadmap items; and identifying and working with suppliers to implement new technologies
- Master of Science in Mechanical Engineering, Physics, or related science required. 2+ years experience preferred, but will train recent graduate
- Knowledge of micro-electronic packaging materials and processes for high power devices and opto-electronic devices; and of thermal solutions for interfaces, bulk materials, heatspreaders, heatsinks, and cooling systems
- FEA and CAD skills (CFD a plus); hands-on lab prototyping, measurements, experimentation and reporting skills
